X11SPi-TF
HIGH PERFORMANCE
Key Features :
- Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W
- Intel® C622 chipset
- Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
- Expansion slots: 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- M.2 NGFF connector
